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AX8300S
UNICOMP
Application Field
| SMT/PCBA | Package type： Semiconductor, Substrate, Lead Frame & Wire Bonding Inspection |
| Semiconductor | Package type：W/B、IC、F/C... Defect type：Void、Open、Short、Sweep、Solder ball... |
| Other areas | Battery, IGBT... |
Function Features
Off line equipment for semiconductors
Equipped with automatic semiconductor detection algorithms
Geometric magnification up to 200 x
Resolution ≤2μm
Detector Tilt Angle 60°
Compatible with 2D, 2.5D, expandable 3D
SPC Chart-CPK&GRR
Technical Parameters and Specifications
| System Summary | |
| Footprint | 1550*1650*1710mm |
| Machine Weight | ≈2500kg |
| Power Supply | 220AC/50Hz |
| Power | 3kW |
| X-ray Leakage | < 1µSv/h |
| Imaging System | |
| Tube Type | Seale |
| Max. Voltage | 110kV |
| Detector | FPD |
Pixel Matrix | 2350*2944 [pixel] |
| * Specifications are subject to change without notice, All trademarks are the property of the system maker. | |
Inspection images
Application Field
| SMT/PCBA | Package type： Semiconductor, Substrate, Lead Frame & Wire Bonding Inspection |
| Semiconductor | Package type：W/B、IC、F/C... Defect type：Void、Open、Short、Sweep、Solder ball... |
| Other areas | Battery, IGBT... |
Function Features
Off line equipment for semiconductors
Equipped with automatic semiconductor detection algorithms
Geometric magnification up to 200 x
Resolution ≤2μm
Detector Tilt Angle 60°
Compatible with 2D, 2.5D, expandable 3D
SPC Chart-CPK&GRR
Technical Parameters and Specifications
| System Summary | |
| Footprint | 1550*1650*1710mm |
| Machine Weight | ≈2500kg |
| Power Supply | 220AC/50Hz |
| Power | 3kW |
| X-ray Leakage | < 1µSv/h |
| Imaging System | |
| Tube Type | Seale |
| Max. Voltage | 110kV |
| Detector | FPD |
Pixel Matrix | 2350*2944 [pixel] |
| * Specifications are subject to change without notice, All trademarks are the property of the system maker. | |
Inspection images
