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Semiconductor Lead Frame In-line X-Ray Inspection Equipment AX8300Si

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  • AX8300SI

  • UNICOMP


Application Field


Mainly used in Semiconductor, Substrate, Lead Frame & Wire Bonding Inspection

SMT/PCBA Package type:

 Semiconductor, Substrate, Lead Frame & Wire Bonding Inspection


Semiconductor Package type:W/B、IC、F/C...
Defect type:Void、Open、Short、Sweep、Solder ball...
Other areas Battery, IGBT...


Function Features


ax8300si

SPC Chart-CPK&GRR


Technical Parameters and Specifications


System Summary
Footprint

2200(W)×1250(D)×1960(H)mm

Machine Weight 2700 kg
Power Supply

AC 110/220V, 50/60H

Power

6.5 kW

X-Ray Tube
Tube Type

 Seale

Voltage 40~110kV (Adjustable)
Current 200 μA

Focus Spot Size

2 μm
                           Imaging System
Detector Flat Panel Detector (FPD)
Effective Detection Area 116.4*145.7mm
Pixel Matrix 2352*2944
Pixel Size 49.5 μm
Frame Rates 37 fps
                       Motion Control System
Movement Control Keypad & Mouse
Max. Loading Area 310*110mm
Max. Inspection Area 270*100mm
                             Industrial PC
Monitor 24’’ FHD Interactive Touch LCD Display
System OS Windows 10 64bit
Hard disk 1TB
RAM 8GB
CPU model Intel i7 Processor
                          Other Features
Door Open Electric Sliding
Authority Management Fingerprint Access Management  System, and Support Password  Accessing.
X-Ray Safety <1μSv/h (Meets All International Standards)
Safety Operation Electromagnetic Interlock, Warning Light  and Real-time Radiation Leakage Monitor
* Specifications are subject to change without notice, All trademarks are the property of the system maker.

ax8300si参数





Inspection images


新官网 01



Dimensions and Appearance


新官网 02


footprint-LX9200

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